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1. Qualcomm/MTK/Spreadtrum chipset solution analysis
2. baseband technical assessment based on platform
3. overall placement and block diagram design
4. GPIO assignment
5. board level PDN and thermal design
6. phone components, sensors, etc. design
7. phone components selections and technical paramters assessment
8. charging circuit design
9. bypass circuit, decoupling circuit design
10. ESD protection and EMI protection

11. using at least one EDS tool, such as Cadence and Power PCB, to implement schematics, symbols, and footprints

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